ADAPT ems has 6 SMT lines across two sites, including a high speed line based around 4 x IPulse pick-and-place machines and 2 SMT lines based around the new Mycronic MYPro A40DX-17 pick-and-place machines. In fact, as is typical for ADAPT this is the first installation of these machines in the UK. This gives ADAPT and a huge amount of SMT capacity and flexibility to cope efficiently with prototyping, low volume and high volume production requirements.
We have both standard hot air reflow and Vapour Phase reflow ovens so there is no need to compromise on product quality due to process restrictions. Whilst our hot air reflow ovens are extremely capable there are some jobs that due to their design (usually where there is a high thermal mass as a result of heavy copper layers and/or extremely large components) where Vapour Phase is really the only option. Both Hitchin and St.Neots have both process
Supporting our state-of-the-art SMT pick and place machines we also have in line 3D inspection processes covering both Solder Paste Inspection (SPI) and Component Automatic Optical Inspection (AOI), in fact again ADAPT is leading the pack by installing the first two Mirtec MV6 OMNI 3D Component AOI machines in the UK.
These are extremely powerful inspection tools and give real time feedback ensuring that the whole SMT process remains within limits for the duration of each assembly run. In addition to the standard 2D inspection process of checking for Missing Component, Wrong Component, Mis-Alignment etc, the Mirtec MV6’s have an enhanced 3D inspections camera system based on Digital Tri-Frequency Moiré Technology capable of inspecting Component Height ±3 um, Lifted Packages, Lifted Leads, Solder Fillet, Etc.
| 2D | Camera System | 15MP / 25MP CoaXPress Camera System |
| Coverage | Missing Component, Wrong Component, Mis-Alignment, Skewed Component, Polarity, Tombstone, Solder Bridge, Flipped Device, Solder Ball, Etc. | |
| 3D | Camera System | Digital Tri-Frequency Moiré Technology – 12 Projection Blue DLP |
| Coverage | Component Height ±3 um, Position, Lifted Package, Lifted Lead, Solder Fillet, Excessive Solder, Insufficient Solder, Solder Bridge, Open Solder, Etc. |
ADAPT ems also employ 3D Solder paste inspection tools. This inspection system is based on dual projection camera system to ensure shadow free Moiré phase to check shape, height and area (volume) of each solder deposition. Solder Paste alignment can also be checked across a panel which is a particular importance on panelised double-sided boards which can exhibit thermal expansion during processing.
| 2D | Camera System | 4MP CameraLink / 15MP CoaXPress Camera System |
| Coverage | Solar Bridge, X/Y Offset, Shape Deformity, etc | |
| 3D | Camera System | Dual Projection Shadow Free Moiré Phase Step Image Processing |
| Coverage | Solder Deposition: Height, Volume / Area, Solder Bridge, X/Y Offset, Shape deformity, etc |
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